Seiko Instruments Inc. (hereinafter referred to as “our company”) hereby announces that our company has won, in “中国福建省高級人民法院” (Fujian Higher People’s Court in China), the design right infringement litigation case against “厦門頂尖電子有限公司” (“Xiamen Pinnacle Electrical Co., Ltd” in English, hereinafter referred to as “Pinnacle Company”), which is an electronic component manufacturer in China.

Our company had previously brought the infringement litigation case regarding the infringement of the design right by Pinnacle Company, which is the same as that in this case, against them, then in November 2019, Pinnacle Company was sentenced to stopping of manufacturing and selling products as the object of their infringement action, and the final judgement was made that our company won the case.

However, even after the final judgement was made, Pinnacle Company did not stop manufacturing and selling infringing products, and thus, our company further brought against them in February 2022 an infringement litigation case for claiming punitive damages.  This infringement litigation was continued to the second instance, and in April 2024, the final judgment was made.  In the judgment, similarly to the first instance, the claim of our company was accepted, and the judgement was given that Pinnacle Company was ordered to pay 3.33 million yuan (about 72  million yen)^*1 in compensation including punitive damages.  Thus, the final judgement was made that our company won the case.

The design right of the subject relates to the outer shape of our product, Thermal Printer Mechanism “LTP02,” which our company has developed for POS markets around the world.

Thermal Printer Mechanism “LTP02”

In the future, if we determine that our intellectual property rights have been infringed, we will take appropriate measures as in this case so as to maintain and enhance the value of our brand.

^*1 Converted at 21.69 yen per yuan (as of June 12, 2024)

[Contact address for this case]
Corporate Planning Dept., Public Information Div.,
https://krs.bz/sii/m/sii_inquiry_en

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